Sinbo Precision Mechanical Co., Ltd.
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As a technical specialist, I confirm copper heat sinks are fundamental for thermal management in electronic devices. Our precision CNC machined copper alloy heat sinks, made from pure copper base material, deliver thermal conductivity up to 401-412W/m·K, nearly double that of aluminum. These sinks efficiently absorb heat from critical components like CPUs and GPUs while maximizing surface area for heat dissipation. Copper's oxidation resistance ensures longevity, with tests showing corrosion rates as low as 0.0178mm/a in pH=8.5 water conditions, outperforming steel by 20-40 times.
| Parameter | Specification |
|---|---|
| Material | Pure Copper (C1100)/Copper Alloy (C1441/C1450) |
| Thermal Conductivity | 401-412W/m·K (Pure Copper) |
| Operating Temperature | -50℃ to 400℃ (Standard)/600℃ (Graphite Composite) |
| Thickness Range | 0.1-3.0mm (0.01mm precision customization available) |
| Density | 8.92g/cm³ (Pure Copper) |
| Surface Treatment | Anti-oxidation coating (PHPS) |
| Insulation | Optional 50-200μm resin layer, UL94V-0 rating |
We deliver end-to-end solutions: first analyzing airflow paths (side/vertical flow) to determine heatsink morphology; then employing dual-cavity MIM technology to create gradient structures combining porous fins (50%-96% density) with high-density bases; finally using trichloroethane solvent debinding and 700℃ hydrogen sintering for structural integrity. Supports standard 15*15mm to custom geometries with 7-10 day lead times.
Our engineering team provides thermal simulation to optimize fin height and pitch. Batch orders include complimentary first-article inspection reports with thermal resistance data. Post-sales support includes on-site installation guidance and graphite-copper composite recommendations for specialized environments.